The main job responsibility is to manage a technical engineering team in the design,

integration and test of technologically advanced Electro-Optical (EO) sensor systems.

The main job responsibility is to manage a technical engineering team in the design, manufacture,

and integration and test of technologically advanced Electro-Optical (EO) sensor systems.

Specific Responsibilities

- Lead a technical engineering team.

- Lead the various engineering disciplines in the development of detailed technical plans

- Work with mechanical, electrical, software and optical engineering.

- Lead the performance modeling/error analysis of the complete EO/IR system

- Manage technical risk on the program and provide guidance and direction 

- Represent engineering.

- Expert in at least one major technical aspect of EO systems; electrical, optical, systems engineering.

In-depth understanding of the operation and performance of EO sensing systems.

Requirements

- Strong personal discipline, verbal & written communication, documentation skills

- Minimum Master's degree in engineering; electrical, optical, and systems are preferred

- Minimum 8 years experience in the design, manufacture and test of advanced electrooptical systems

- Minimum 3 years supervision of a multi-disciplined engineering team working electrooptical systems

- US citizenship and ability to obtain a security clearance required

As part of a new development program, you will be responsible for aircraft structural concepts, layouts, interfaces, details and installation drawings of aircraft structural components.

You have a Bachelor's degree or a Technical College degree in mechanical/aerospace engineering and a minimum of five (5) years of relevant experience in the aerospace industry.  Knowledge of CATIA is required and Catia V5 is a definite asset.Carbon Fiber composite experience would be an asset.This position requires energetic people with good communication skills, who are willing to accept responsibilities in a team-working environment.

Are you a cutting edge IC Design engineer??  Do you bleed silicon and GaAs?

Our Client designs and manufactures RF modules that enable the transmission, reception and processing of high-frequency signals in next generation wireless telecommunications networks, defense electronics and homeland security systems. They have dedicated teams with the vast market experience necessary to win in these competitive industries.

Our Client has a hard earned reputation as the technology leader in  the market With 42 issued patents covering our core technologies, including semiconductor and proprietary circuit designs.  Tthe team possesses the critical know-how to develop leading edge subsystems.

Job Duties & Responsibilities
We are looking for a strong electrical engineer with knowledge of MMIC design and packaging. The individual will be designing MMICs in processes such as GaAs, InP, and SiGe HBT and PHEMTs and will also be working on integrating our new and existing components in packages such as LTCC, LCP, LGA and QFN.
As part of a product driven R&D team, work with other engineers to define, design, simulate and evaluate MMICs and Packages. Work also with technicians and assemblers in test, characterization and product development.
Responsibilities include designing MMIC amplifiers, multipliers, oscillators, mixers, dividers& meeting requirements for noise figure, gain, power, harmonics, sensitivity,& These designs are to meet Endwaves requirements in new or existing commercial and defense products.
The complexity of MMIC and packages range from one stage circuits to several stages ranging in frequency from a couple of megahertz to >50 gigahertz.
Linear/Nonlinear, Electromagnetic and Thermal simulation of MMICs and Packages.
Designing custom packages that incorporate the new and existing standard MMICs.
Design for Manufacturing, Specifying test plans, travelers, and the environmental screening of finished designs.

Job Qualifications
For our San Jose location, we require candidates to be U.S. Citizens or Permanent Residents.
Excellent judgment and initiative in performing electrical design activities pertaining to commercial and military hardware including technology, circuit topology and device selection, foundry processes, microwave packaging design, environmental qualification, and thermal considerations.
Familiarity with all aspects of electrical design documentation including MRP, MMIC and printed circuit board schematics/layout, microwave circuit layout and mechanical design.
BSEE plus 5 yrs experience or MSEE plus 3 yrs experience or PhD and zero to one yr. experience.
Proficient in using circuit design, layout, EM, and thermal software

Desired:
MSEE and/or Ph.D. with graduate work in IC design and/or packaging
>1 year experience in RF and Microwave ICs and packaging design.
Proficient in using ADS or Microwave Office, Cadence, HFSS, AutoCAD
Solid skills in test and measurement, on-wafer and co-axial
Knowledge of Digital Microwave Radio, transceivers or components